1.Application Fields:

PCB industry production process, the process will produce a large number of micro-etching solution, etching solution, copper nitrateand other substances, which containing different concentrations ofcopper.

Electrocatalytic oxidation electrode plate

2.Application system:

Micro-etching solution :Titanium Coated with Iridium-Tantalum

Alkaline etching solution :Titanium Coated with Iridium-Tantalum

Acid etching solution: Titanium Coated with Ruthenium Iridium

Titanium Anode for Copper Recovery from Etching Solution

3.Current density: (200-400)A/m2

4.Service life: can be customized according to customer requirements, generally 2 years/3 years/5 years

5.Technological Process:

·Micro-etching solution (Cu2SO4+H2O2) –Oxygen-breaking electrolytic cell (decomposition of H2O2) –Electro Deposited Copper

·Alkaline etching solution –extraction process — copper sulphate + sulphuric acid –Electro Deposited Copper

·Acid etchingsolution – Ionic membrane electrolysis (Electro Deposited Copper) – tail gas treatment (absorption of chlorine gas)

Titanium Anode for Copper Recovery from Etching Solution

6.Electrochemical Performance and Service Life Testing

Name Strengthening weightlessness mgpolarizability mvOxygen evolution/Chlorine potential VTest condition
Titanium Coated with Iridium-Tantalum≤1＜40＜1.451mol/L H2SO4
Titanium Coated with Ruthenium Iridium≤10＜40＜1.131mol/L H2SO4

7.Use Environment and Introduction of Product :

PCB industry production process, the process produces a large number of micro-etching solution, etching solution, copper nitrate and other substances, which containing different concentrations of copper and other metals. It has high recovery value, and there will also be a small amount of copper heavy metals in the effluent.  If we can not reasonably carry out environmental protection treatment, on the one hand, causing a serious waste of resources, on the other hand, heavy metal discharge into the soil and water, that is, it will produce serious pollution and harm to natural environment we rely on and our own health.

Titanium anode for acid etching solution recovery

1）Micro-etching Solution

Micro-etching solution including sodium persulfate / sulfuric acid system and hydrogen peroxide / sulfuric acid system. In recent years, widely used in the surface treatment process of PCB, such as: Plated-Through Hole (PTH) Process, Electroplating Process, Inner Layer Pretreatment, Solder Mask Pretreatment, OSP Treatment and other production lines. Besides, direct electrolysis will cause damage on the anode coating .

2）Etchant solution

During the etching process of PCB circuit, the copper content in the etching solution gradually increases. Etching solution to achieve a better etching effect, each liter of etching solution needs to contain 120 to 180 grams of copper and the corresponding amount of etching salt (NH4CI) and ammonia (NH3). The etchant regeneration cycle system has acidic and alkaline, and the two systems can be divided into extraction method and direct electrolysis method. Through generating revivification, a large amount of used etchant that originally needs to be discharged into regenerated etchant that can be used again. This can reduce the discharge of industrial waste liquid, reduce production costs by reusing, and can extract high purity electrolytic copper metal.

Electrolysis water treatment

8.Types of titanium anodes

  • Titanium anode for alkaline etching solution regeneration and copper recovery (extraction process)
  • Titanium anode for alkaline etching solution regeneration and copper recovery (direct electrolysis process)
  • Titanium anode for regeneration of acid etching solution and copper recovery (membrane electrolysis process)
  • Titanium anode for regeneration of micro-etching solution and copper recovery
  • Titanium anode for copper extraction from micro-etching solution
  • Titanium anode for copper extraction from low copper-containing wastewater