Electroplating is the plating of a thin layer of a metal such as copper, nickel, tin, gold, silver, platinum, rhodium, palladium, or an alloy thereof onto the surface of an electronic component. The electroplating process can be used in a wide variety of applications, including board plating for batch plating processes, connector plating, and a variety of continuous plating processes for the production of semiconductors, connectors, and other components used in the electronics industry. .
There are many kinds of plating methods and methods for electroplating in the electronics industry. At present, there is a new type of electroplating production line in the printed circuit industry, that is, a vertical continuous automatic line using an insoluble titanium-based oxide coated anode, which uses an insoluble anode. It is also equipped with spray technology and diaphragm technology to reduce the small size of additives, add oxidized metals, and supplement metal ions.
In each process of the electroplating process, the insoluble anodes are selected differently depending on the composition of the electrolyte, the additives, and the electrolysis conditions. Therefore, the types, compositions, and amounts of the anodes are selected according to actual working conditions.
Titanium based oxide coated anode
1, substrate: TA1
2, coating: platinum, lanthanide, lanthanide + multi-metal oxide formula
3, specifications: 10-3000mm
4. With such an anode, the plating density of the full plate surface on the printed board surface can be kept evenly distributed, and the process is clean.